Layout method for printed circuit board

ABSTRACT

A layout method for a printed circuit board (PCB) is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group includes a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module includes layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application is a continuation of and claims priority of ChinaPatent Application No. PCT/CN2012/082884, filed on Oct. 12, 2012, theentirety of which is incorporated by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a layout method for a printed circuit board(PCB), and more particularly, to a layout method of an embeddedmulti-chip package (eMCP) for a PCB.

2. Description of the Related Art

Recently, electrical products tend to have higher efficiencies and besmaller. Therefore, sizes of printed circuit boards (PCB) and chipsmounted on the PCBs are continuing to be miniaturized, while frequenciesof electronic signals transmitted on the PCBs are being increased.

A PCB layout diagram file (design) is created based on a circuitschematic diagram, and includes a plurality of layout modules. Whendesigning a PCB using layout software (e.g. an electronic designautomation (EDA) tool), signal performances of the components should beconsidered. For example, time is needed to arrange the placement of amemory and other related chips and the traces of high speed busesbetween the memory and the chips for a product manufacturer.

BRIEF SUMMARY OF THE INVENTION

Layout methods for a printed circuit board (PCB) are provided. Anembodiment of a layout method for a PCB is provided. A memory type of adynamic random access memory (DRAM) to be mounted on the PCB isobtained. A module group is obtained from a database according to thememory type of the DRAM, wherein the module group comprises a pluralityof routing modules. A plurality of PCB parameters are obtained. Aspecific routing module is selected from the module group according tothe PCB parameters. The specific routing module is implemented into alayout design of the PCB. The specific routing module comprises layoutinformation regarding a main chip, a memory chip and a routingconfiguration between the main chip and the memory chip.

Furthermore, another embodiment of a layout method for a PCB isprovided. Electronic design automation (EDA) information regarding a PCBEDA tool is obtained. A memory type of a dynamic random access memory(DRAM) to be mounted on the PCB is obtained. A module group is obtainedfrom a database according to the memory type of the DRAM and the EDAinformation, wherein the module group comprises a plurality of routingmodules. A plurality of PCB parameters are obtained. A specific routingmodule is selected from the module group according to the PCBparameters. The specific routing module is implemented into a layoutdesign of the PCB provided by the PCB EDA tool. The specific routingmodule comprises layout information regarding a main chip, a memory chipand a routing configuration between the main chip and the memory chip.

Moreover, another embodiment of a layout method for a PCB is provided,wherein the layout method is performed by a server. A project IDcorresponding to the PCB from a client is obtained. The project ID isrecognized to determine whether the project ID exists in an accountlist. At least one module group from a database of a server is obtainedaccording to the project ID when the project ID does not exist in theaccount list, wherein the module group comprises a plurality of routingmodules. A plurality of PCB parameters are obtained. At least onespecific routing module is selected from the module group according tothe PCB parameters. The specific routing module is provided to theclient. The project ID is added into the account list. The specificrouting module comprises layout information regarding a main chip, amemory chip and a routing configuration between the main chip and thememory chip. The client implements the specific routing module into alayout design of the PCB.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

The invention can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 shows a schematic illustrating an embedded multi-chip package(eMCP);

FIG. 2 shows a circuit design simulation system for a printed circuitboard according to an embodiment of the invention;

FIG. 3A shows a schematic illustrating a layout module for a PCBaccording to an embodiment of the invention;

FIG. 3B shows an example illustrating a routing configuration of thelayout module of FIG. 3A;

FIG. 3C shows a table illustrating a module group of a specific eMCPchip (e.g. LPDDR2+eMMC);

FIG. 4 shows a layout method for a PCB according to an embodiment of theinvention, wherein the layout method is performed by the circuit designsimulation system of FIG. 2;

FIG. 5 shows a schematic illustrating a layout design according to anembodiment of the invention;

FIG. 6A shows a schematic illustrating a layout module for a PCBaccording to another embodiment of the invention;

FIG. 6B shows a schematic illustrating a layout module for a PCBaccording to another embodiment of the invention;

FIG. 7 shows a layout server and a plurality of clients according to anembodiment of the invention; and

FIG. 8 shows a layout method for a PCB according to another embodimentof the invention, wherein the layout method is performed by the layoutserver of FIG. 7.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best-contemplated mode of carryingout the invention. This description is made for the purpose ofillustrating the general principles of the invention and should not betaken in a limiting sense. The scope of the invention is best determinedby reference to the appended claims.

FIG. 1 shows a schematic illustrating an embedded multi-chip package(eMCP) 100. In general, eMCP is a kind of package type for mobile memorywhich integrates a mobile DRAM and a flash memory into one chip. In FIG.1, the eMCP 100 comprises an Embedded MultiMediaCard (eMMC) 120 and amobile DDR 150. The eMMC 120 conforms to a flash memory card standard,which describes an architecture consisting of an embedded storagesolution with a controller 130 and a flash memory 140. Furthermore, thecontroller 130 and the flash memory 140 are integrated in a ball gridarray (BGA) package. Moreover, Mobile DDR 150 (also known as Low PowerDDR (LPDDR)) is a type of double data rate (DDR) synchronous DRAM formobile computers. Using the eMCP 100 helps to save a lot of hardwarespace, thus allowing mobile devices (e.g. a smart phone) to be thinnerand casings to be enclosed more properly. The major defect of an eMCP isthe design issues of high-speed memory buses on PCBs.

FIG. 2 shows a circuit design simulation system 200 for a printedcircuit board according to an embodiment of the invention. The circuitdesign simulation system 200 comprises a processor 210, a display 220, astorage unit 230 and a user interface 240. The display 220, the storageunit 230 and the user interface 240 are coupled to the processor 210.The user interface 240 is used to receive layout information or settings(e.g. layout parameters, net-lists and so on) provided by a designer.The storage unit 230 comprises a database for storing a plurality oflayout modules. The processor 210 is used to perform a PCB electronicdesign automation (EDA) tool, which obtains the layout information orsettings from the user interface 240 and performs a PCB circuit layoutdesign according to the layout modules from the storage unit 230, so asto display a layout design on the display 220. In one embodiment, thestorage unit 230 is disposed in a server.

FIG. 3A shows a schematic illustrating a layout module 300 for a PCBaccording to an embodiment of the invention. The layout module 300comprises a memory chip 310 and a main chip 320, wherein the memory chip310 is an eMCP package and the main chip 320 is a system on chip (SOC)chip. By designing the PCB routing between the chips 310 and 320 to be arouting module in advance, the design of high-speed memory buses issimplified for the PCB, whereby it is easy to mount or repair thecomponents of the PCB and costs and design times are decreased for aproduct manufacturer.

FIG. 3B shows an example illustrating a routing configuration of thelayout module 300 of FIG. 3A. In FIG. 3B, the chips 310 and 320 are BGApackages. In FIG. 3B, only a portion of the pads/vias 330, a portion ofthe pads/vias 340 and a portion of the traces 350 are displayed tosimplify description, wherein the pads/vias 330 are designed for thepins of the chip 310, the pads/vias 340 are designed for the pins of thechip 320, and the traces 350 are designed for interconnection betweenthe chips 310 and 320. According to various PCB standard parameters(e.g. layers, stack-up and via type, etc.), a plurality of routingmodules can be provided for the same eMCP chip 310 and the same SOC chip320. FIG. 3C shows a table illustrating a module group of a specificeMCP chip (e.g. LPDDR2+eMMC). In the table of FIG. 3C, the module groupcomprises 12 routing modules MMD_S1-MMD_S6 and MMD_D1-MMD_D6 for thechips 310 and 320. Furthermore, the PCB standard parameters comprise alayer count (e.g. 8 or 10 Layers), a stack-up setting (e.g. high densityinterconnect (HDI)+1 or HDI+2) and a via type (stagger via or stackedvia). For example, the routing modules MMD_S1-MMD_S6 are provided for8-layer PCBs, and the routing modules MMD_D1-MMD_D6 are provided for10-layer PCBs. Moreover, a component placement parameter indicates thatthe components can be mounted on a single-sided or double-sided PCB.

FIG. 4 shows a layout method for a PCB according to an embodiment of theinvention, wherein the layout method is performed by the circuit designsimulation system of FIG. 2. Referring to FIG. 2 and FIG. 4 together, instep S410, electronic design automation (EDA) information regarding aPCB EDA tool is obtained by the processor 210. Next, in step S420, amemory type of a mobile DRAM is obtained by the processor 210, whereinan eMCP chip comprising the mobile DRAM is to be mounted on the PCB. Inone embodiment, the memory type of the mobile DRAM is input by a uservia the user interface 240. In another embodiment, the memory type ofthe mobile DRAM is obtained according to a net-list of the PCB from theuser interface 240 or the storage unit 230. Next, in step S430, theprocessor 210 transmits a requirement corresponding to the memory typeof the mobile DRAM and the EDA information to the storage unit 230, soas to obtain a module group from the database of the storage unit 230,wherein the module group comprises a plurality of routing modulescorresponding to the memory type of the mobile DRAM. Next, in step S440,a plurality of PCB parameters are obtained by the processor 210, whereinthe PCB parameters comprises a layer count, a stack-up setting, a viatype and component placement information of the PCB. In one embodiment,the PCB parameters are input by a user via the user interface 240. Inanother embodiment, the PCB parameters are obtained according to anet-list of the PCB from the user interface 240 or the storage unit 230.Next, in step S450, a suitable routing module is selected from themodule group according to the PCB parameters. For example, if the layercount is “8”, the stack-up setting is “HDI+1”, the via type is “1+6+1”and the component placement is “double-sided”. The processor 210 mayselect the routing module MMD_S2 from the table of FIG. 2 as thesuitable routing module. Next, in step S460, the suitable routing moduleis implemented into a layout design displayed in the display via the PCBEDA tool, as shown in FIG. 5. In one embodiment, the suitable routingmodule is fully implemented in the layout design. In another embodiment,the suitable routing module is partially implemented in the layoutdesign. For example, the placement of an eMCP chip, a SOC chip andperipheral components (e.g. bypass capacitors) are copied to the layoutdesign. Next, the traces, the vias and the power/ground planes arecopied to the layout design, and then the traces, the vias and thepower/ground planes are modified by a user via the user interface 240.Specifically, the eMCP chip and the main chip are completely implementedin the layout design, and the routing configuration is partiallyimplemented in the layout design.

FIG. 6A shows a schematic illustrating a layout module 600 for a PCBaccording to another embodiment of the invention. The layout module 600comprises a package-on-package (POP) package 610 and a power managementchip 620. The POP package 610 comprises at least two chips, wherein oneof the chips is a main chip and the other chip is a memory chip. In theembodiment, the memory chip is a DRAM. Furthermore, the power managementchip 620 is used to provide various voltages to the POP package 610 andother devices on the PCB. In the embodiment, no DRAM is mounted on thePCB because the DRAM has been integrated into the POP type package,thereby decreasing design complexity. Furthermore, by designing the PCBrouting between the POP package 610 and the power management chip 620 tobe a routing module according to power delivery network (PDN) on the PCBin advance, the design of power arrangement is simplified for the PCB.As described above, according to various PCB standard parameters (e.g.layers, stack-up and via type, etc.) and the type of the memory chip ofthe POP package 610, a plurality of routing modules can be provided forthe POP package 610 and the power management chip 620. Similarly,according to various power requirements, a table illustrating a modulegroup of a specific power management chip can also be established.

Furthermore, the amount of the chips of a layout module can be more thantwo. FIG. 6B shows a schematic illustrating a layout module 650 for aPCB according to another embodiment of the invention. The layout module650 comprises a memory chip 660, a main chip 670 and a power managementchip 680, wherein the memory chip 660 is a DARM chip and the main chip670 is a SOC chip. In the embodiment, by designing the PCB routingbetween the memory chip 660, the main chip 670 and the power managementchip 680 to be a routing module in advance, the design of powerarrangement and high-speed memory buses is simplified for the PCB,whereby it is easy to mount or repair the components of the PCB andcosts and design times are decreased for a product manufacturer. Asdescribed above, according to various PCB standard parameters (e.g.layers, stack-up and via type, etc.) and the type of memory chip 660, aplurality of routing modules can be provided for the memory chip 660,the main chip 670 and the power management chip 680. Furthermore, theplacement of the memory chip 660, the main chip 670 and the powermanagement chip 680 is determined according to the memory type of thememory chip 660 and the PDN of the PCB. Specifically, the PCB routingbetween the large and complex chips can be designed to be a routingmodule in advance, so as to simplify the PCB design.

FIG. 7 shows a layout server 710 and a plurality of clients 720A-720Daccording to an embodiment of the invention. The layout server 710comprises at least one database 730 for storing a plurality of layoutgroups. Furthermore, the database 730 further comprises a look up tablewhich records the relationships between the module groups and variousPCB projects. Each of the clients 720A-720D may comprises a processor(e.g. the processor 210 of FIG. 2), a display (e.g. the display 220 ofFIG. 2) and the user interface (e.g. the user interface 240 of FIG. 2).In one embodiment, each of the clients 720A-720D may be the circuitdesign simulation system 200 of FIG. 2. The user interface is used toreceive layout information or settings (e.g. layout parameters,net-lists and so on) provided by a designer. The processor is used toperform a PCB electronic design automation (EDA) tool, which obtains thelayout information or settings from the user interface and performs aPCB circuit layout design according to the layout modules from thelayout server 710, so as to display a layout design on the display. IfFIG. 7, the layout modules stored in the database of the layout server710 can be accessed by the clients 720A-720D, respectively. As describedabove, according to various PCB standard parameters (e.g. layers,stack-up and via type, etc.) and the types of a memory chip, a pluralityof routing modules can be provided. Similarly, according to variouspower requirements, a table illustrating a module group of a specificpower management chip can also be established. Furthermore, a user ofthe client can find the suitable routing modules by checking requiredparameters on the look up table.

FIG. 8 shows a layout method for a PCB according to another embodimentof the invention, wherein the layout method is performed by the layoutserver 710 of FIG. 7. Referring to FIG. 7 and FIG. 8 together, in stepS810, electronic design automation (EDA) information regarding a PCB EDAtool is obtained by the layout server 710, wherein the EDA informationis provided by one of the clients 720A-720D. Next, in step S820, thelayout server 710 obtains a project ID from the client. Next, in stepS830, the layout server 710 recognizes the project ID to determinewhether the project ID exists in an account list, wherein the accountlist is stored in the database 730 and records the information regardingthe project IDs that have logged in successfully. If the project ID doesnot exist in the account list, the layout server 710 obtains therequired module groups from the database 730 according to the EDAinformation, the project ID and the look up table of the database 730(step S840), wherein each required module group comprises a plurality ofrouting modules corresponding to the project ID. Furthermore, the lookup table can be modified by the client. In one embodiment, the look uptable is provided by the client. Next, in step S850, a plurality of PCBparameters are obtained by the layout server 710, wherein the PCBparameters comprises a layer count, a stack-up setting, a via type andcomponent placement information of the PCB. In the embodiment, the PCBparameters are stored in the database 730, and the PCB parameters can bemodified by the client. In one embodiment, the PCB parameters are inputby a user via the client. In another embodiment, the PCB parameters areobtained according to a net-list of the PCB from the client or thedatabase 730. Next, in step S860, the suitable routing modules areselected from the module groups according to the PCB parameters. Next,in step S870, the layout server 710 provides the suitable routingmodules to the client (i.e. the suitable routing modules are downloadedto the client), so as to implement the suitable routing modules to alayout design via the PCB EDA tool. Simultaneously, the layout server710 adds the project ID into the account list. As described above, theclient can fully or partially implements the suitable routing modulesinto the layout design of the PCB. Referring back to step S830, if theproject ID exists in the account list, the layout server 710 willdetermine whether the suitable routing modules corresponding to theproject ID have been updated in the database 730. If yes, the layoutserver 710 provides the updated version of the routing modules to theclient (step S880). Thus, the layout design can be updated.

Furthermore, the module groups and the look up table, and the PCBparameters can be stored in a storage media, such as a Flash memorydevice or an optical disc. Thus, the storage media can be delivered tovarious users. The routing modules of the module groups are compatiblewith the user's PCB EDA tool, thereby the users can easily copy and usethe routing modules on various PCB layout design.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A layout method for a printed circuit board(PCB), comprising: obtaining a memory type of a dynamic random accessmemory (DRAM) to be mounted on the PCB; obtaining a module group from adatabase according to the memory type of the DRAM, wherein the modulegroup comprises a plurality of routing modules; obtaining a plurality ofPCB parameters; selecting a specific routing module from the modulegroup according to the PCB parameters; implementing the specific routingmodule into a layout design of the PCB; and fabricating the PCB based onthe specific routing module implemented into the layout design of thePCB, wherein the specific routing module comprises layout informationregarding a main chip, a memory chip and a routing configuration betweenthe main chip and the memory chip.
 2. The layout method as claimed inclaim 1, wherein the DRAM is a mobile memory, and the DRAM and a flashmemory are packaged in the memory chip.
 3. The layout method as claimedin claim 1, wherein the main chip is a system on chip (SOC) chip.
 4. Thelayout method as claimed in claim 1, wherein the step of obtaining themodule group from the database according to the memory type of the DRAMfurther comprises: transmitting a requirement corresponding to thememory type of the DRAM, to the database; and receiving the routingmodules corresponding to the memory type of the DRAM from the database,wherein the database is disposed in a server, and the server providesthe routing modules in response to the requirement.
 5. The layout methodas claimed in claim 4, wherein the requirement comprises informationregarding a PCB electronic design automation (EDA) tool.
 6. The layoutmethod as claimed in claim 1, wherein the PCB parameters comprises alayer count, a stack-up setting, a via type and component placementinformation of the PCB.
 7. The layout method as claimed in claim 6,wherein the via type of the PCB represents whether a plurality of viasof the PCB are stagger vias or stacked vias.
 8. The layout method asclaimed in claim 6, wherein the component placement informationrepresents whether the PCB is a single-sided PCB or a double-sided PCB.9. The layout method as claimed in claim 1, wherein the step ofimplementing the specific routing module into the layout design of thePCB further comprises: fully implementing the specific routing moduleinto the layout design of the PCB, so as to completely implement themain chip, the memory chip and the routing configuration into the layoutdesign of the PCB; or partially implementing the specific routing moduleinto the layout design of the PCB, so as to completely implement themain chip and the memory chip and partially implement the routingconfiguration into the layout design of the PCB.
 10. A layout method fora printed circuit board (PCB), comprising: obtaining electronic designautomation (EDA) information regarding a PCB EDA tool; obtaining amemory type of a dynamic random access memory (DRAM) to be mounted onthe PCB; obtaining a module group from a database according to thememory type of the DRAM and the EDA information, wherein the modulegroup comprises a plurality of routing modules; obtaining a plurality ofPCB parameters; selecting a specific routing module from the modulegroup according to the PCB parameters; implementing the specific routingmodule into a layout design of the PCB provided by the PCB EDA tool; andfabricating the PCB based on the specific routing module implementedinto the layout design of the PCB, wherein the specific routing modulecomprises layout information regarding a main chip, a memory chip and arouting configuration between the main chip and the memory chip.
 11. Thelayout method as claimed in claim 10, wherein the DRAM is a mobilememory, and the DRAM and a flash memory are packaged in the memory chip.12. The layout method as claimed in claim 10, wherein the main chip is asystem on chip (SOC) chip.
 13. The layout method as claimed in claim 10,wherein the step of obtaining the module group from the databaseaccording to the memory type of the DRAM and the EDA information furthercomprises: transmitting a requirement corresponding to the memory typeof the DRAM and the EDA information, to the database; and receiving therouting modules corresponding to the memory type of the DRAM from thedatabase, wherein the database is disposed in a server, and the serverprovides the routing modules in response to the requirement.
 14. Thelayout method as claimed in claim 10, wherein the PCB parameterscomprises a layer count, a stack-up setting, a via type and componentplacement information of the PCB.
 15. The layout method as claimed inclaim 14, wherein the via type of the PCB represents whether a pluralityof vias of the PCB are stagger vias or stacked vias.
 16. The layoutmethod as claimed in claim 14, wherein the component placementinformation represents whether the PCB is a single-sided PCB or adouble-sided PCB.
 17. The layout method as claimed in claim 10, whereinthe step of implementing the specific routing module into the layoutdesign of the PCB further comprises: fully implementing the specificrouting module into the layout design of the PCB, so as to completelyimplement the main chip, the memory chip and the routing configurationinto the layout design of the PCB; or partially implementing thespecific routing module into the layout design of the PCB, so as tocompletely implement the main chip and the memory chip and partiallyimplement the routing configuration into the layout design of the PCB.18. A layout method for a printed circuit board (PCB), comprising:obtaining a project ID corresponding to the PCB from a client;recognizing the project ID to determine whether the project ID exists inan account list; obtaining at least one module group from a database ofa server according to the project ID when the project ID does not existin the account list, wherein the module group comprises a plurality ofrouting modules; obtaining a plurality of PCB parameters; selecting atleast one specific routing module from the module group according to thePCB parameters; providing the specific routing module to the client andadding the project ID into the account list, wherein the specificrouting module comprises layout information regarding a main chip, amemory chip and a routing configuration between the main chip and thememory chip, wherein the client implements the specific routing moduleinto a layout design of the PCB; and fabricating the PCB based on thespecific routing module implemented into the layout design of the PCB.19. The layout method as claimed in claim 18, wherein the DRAM is amobile memory, and the DRAM and a flash memory are packaged in thememory chip.
 20. The layout method as claimed in claim 18, wherein themain chip is a system on chip (SOC) chip.
 21. The layout method asclaimed in claim 18, further comprising: obtaining PCB informationregarding a PCB electronic design automation (EDA) tool, wherein themodule group is obtained according to the project ID and the PCBinformation.
 22. The layout method as claimed in claim 18, wherein thePCB parameters is provided by the database or the client.
 23. The layoutmethod as claimed in claim 18, wherein the PCB parameters comprises alayer count, a stack-up setting, a via type and component placementinformation of the PCB.
 24. The layout method as claimed in claim 23,wherein the via type of the PCB represents whether a plurality of viasof the PCB are stagger vias or stacked vias.
 25. The layout method asclaimed in claim 23, wherein the component placement informationrepresents whether the PCB is a single-sided PCB or a double-sided PCB.26. The layout method as claimed in claim 18, wherein the client fullyimplements the specific routing module into the layout design of thePCB, so as to completely implement the main chip, the memory chip andthe routing configuration into the layout design of the PCB.
 27. Thelayout method as claimed in claim 18, wherein the client partiallyimplements the specific routing module into the layout design of thePCB, so as to completely implement the main chip and the memory chip andpartially implement the routing configuration into the layout design ofthe PCB.
 28. The layout method as claimed in claim 18, furthercomprising: determining whether the specific routing module has beenupdated in the database; and providing the updated specific routingmodule to the client.
 29. A method for providing a client with access toa file, comprising: providing a list of a plurality of types of aprinted circuit board (PCB) to the client for selecting; providing aplurality of routing modules according to the types of the PCB selectedby the client, wherein each of the routing modules comprises a routingconfiguration adjacent to a main chip; transmitting the file comprisingthe routing modules to the client from a first electronic device to asecond electronic device; providing a list of a plurality of types of amemory chip to the client for selecting, wherein each of the routingmodules comprises the routing configuration between the main chip andthe type of the memory chip selected by the client; and fabricating thePCB based on at least one of the routing modules of the file transmittedto the second electronic device.
 30. The method as claimed in claim 29,wherein a mobile memory and a flash memory are packaged in the memorychip, and the main chip is a system on chip (SOC) chip.
 31. The methodas claimed in claim 29, wherein the step of transmitting the filecomprising the routing modules to the client from the first electronicdevice to the second electronic device further comprising: selecting atleast one specific routing module from the routing modules according tothe type of the PCB selected by the client; and providing the specificrouting module to the client via the file.
 32. The method as claimed inclaim 29, wherein the type of the PCB selected by the client correspondsto a plurality of PCB parameters, and the PCB parameters comprise alayer count, a stack-up setting, a via type and component placementinformation of the PCB.
 33. The method as claimed in claim 29, whereinthe file is stored in a storage media.
 34. A method for delivering arouting module to a client, comprising: receiving a printed circuitboard (PCB) parameter from a client; selecting a routing module from adatabase according to the PCB parameter; receiving memory typeinformation of a memory chip from the client; providing the routingmodule to the client; and fabricating a PCB based on the selectedrouting module provided to the client, wherein the routing modulecomprises a routing configuration adjacent to a main chip, wherein therouting module comprises the routing configuration between the main chipand the memory chip.
 35. The method as claimed in claim 34, wherein amobile memory and a flash memory are packaged in the memory chip, andthe main chip is a system on chip (SOC) chip.
 36. The method as claimedin claim 34, wherein the PCB parameter comprises a layer count, astack-up setting, a via type or component placement information of thePCB.
 37. The method as claimed in claim 34, wherein the routing moduleis provided to the client via a storage media.